MEMS Device Design
Structural Edit of MEMS components using FIB permits rapid prototype development
Device Modification for Micro-Electrical- Mechanical-Structures development engineers.
MEMS device modification is the ability to quickly tweak the physical structure of a MEMS component to enable the rapid testing or qualification of its physical behaviour.
‘Structural Edit’ of MEMS components using FIB permits rapid prototype development.
IC designers have routinely used FIB technology for 20 years. They have used it to shorten the development cycles of new chip designs, ramp up production yield, and reduce the costs and time to market of new products. Many IC companies have branched out into MEMS development and are already using inhouse FIB instruments to enhance their competitive edge for developing new MEMS products.
NanoScope can rapidly and precisely modify the physical structure of small and medium sized lots of test devices so that direct empirical performance data can be collected in a short time frame without having to develop complex or new modelling techniques. Designs can be adapted to related application and proof of concept for new designs can be quickly obtained using this method. To find out what is possible call NanoScope now.
MEMS device modification of an accelerometer(50% reduction in spring strength)
“NanoScope..have provided a highly professional FIB service, offering good advice to achieve the best results and fast turn-around. Their experience and understanding of the needs of Nanotech’s designers has been invaluable.”
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Circuit Nano-Surgery and Failure Analysis Online Tutorial
NanoScope gave an Online invited Tutorial on behalf of IMAPS UK on the 18th September on the subject of Focused Ion Beam (FIB) Circuit Nano-Surgery and Failure Analysis from Board to Gate.
read moreE-Newsletter Summer 2019
Here are some examples of our new services, and how they complement our existing imaging and non-destructive analysis. There is a quick guide to the specific advantages of each technique to show how your FA, NPI or development project can benefit.
read moreE-Newsletter Spring 2014
IC Decap, MEMS Gel coat removal and through WL-CSP modification capabilities available now
read moreNew Dual Acid FIB edit capabilities available now.
NanoScope has brought Dual-Acid decapsulation in-house, and extended those capabilities.
This equipment was part of a larger equipment acquisition and more FA and other capabilities will become available over the next few weeks.
New Decapsulation Capability Coming Soon
NanoScope has been successful in acquiring much of the FA capability of the Unisem facility and we are now in the process of transferring this equipment over to our Bristol Laboratory.
read moreAccelerating MEMS development with FIB Nano-Surgery
Here I discuss why the growth in MEMS development is lagging the growth that was witnessed for IC development in many respects – but highlighting that there are valuable lessons available to accelerate future growth too.
read more